STMicroelectronics News
STMicroelectronics Cuts Capacitance and Footprint for USB 2.0 ESD Protection
The compact footprint and low package height make the USBULC6-2M6 ideal for mobile phones, handheld computers, personal media players and other portable high-speed communicators requiring IEC61000-4-2 protection. The device meets level 4 specifications to 15kV air-gap discharge and 8kV contact discharge, and has a breakdown voltage of 6.1V. In addition, the low maximum leakage current of 0.5 microamps reduces power consumption and preserves battery life.
The USBULC6-2M6 is internally optimized for maximum signal transparency, and features a go-through pin arrangement to simplify board layout and preserve impedance matching of the complete data line.
By providing two complementary protection-diode networks, with capacitance matching within 0.1pF, the USBULC6-2M6 is suitable for a wide range of high-speed differential and single-ended signaling applications. Zero insertion loss is specified up to 3GHz, allowing use in applications such as Gigabit Ethernet as well as future high-speed protocols. Further benefits include very low clamping voltage compared to metal oxide varistors, which is are alternative devices for the application, to provide enhanced protection for sub-100nm CMOS ICs.
The USBULC6-2M6 is available now at
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were
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