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LogicVision, Inc. News

LogicVision to Present at the AeA Micro Cap Financial Conference

SAN JOSE, Calif., May 1 PRNewswire-FirstCall — LogicVision, Inc. (Nasdaq: LGVN), a leading provider of test and yield learning solutions, will present at the AeA Micro Cap Financial Conference in Monterey, California. Mr. James T. Healy, LogicVision's president and CEO, Mr. Bruce M. Jaffe, LogicVision's chief financial officer, and Farhad Hayat, LogicVision's vice president of marketing, are scheduled to present on Monday, May 5, 2008. During the presentation, management will outline its value proposition as the semiconductor world embraces testing system-on-a-chip (SoC) semiconductors from the inside and how the Company's "eyes-In-the-die" built-in-self-test products provide a cost effective way to test these complex chips, enhancing product margins for its customers. A webcast of the presentation will be available:

Date: Monday, May 5, 2008 Time: 4:15 P.M. Eastern Time / 1:15 P.M. Pacific Time for the live presentation Location: On the web at http://investor.shareholder.com/lgvn/events.cfm Replay: Available one hour after the presentation ends and accessible for 90 days.

About LogicVision, Inc.

LogicVision (Nasdaq: LGVN) provides proprietary technologies for embedded test and yield learning that enable more efficient manufacturing test of complex semiconductors. LogicVision's embedded test solutions allow integrated circuit designers to embed test functionality into a semiconductor design that is used during semiconductor production test and throughout the useful life of the chip. The company's advanced Design for Test (DFT) product line, ETCreate, works together with Silicon Insight applications and Yield Insight to improve profit margins by reducing device field returns and test costs, accelerating silicon bring-up times and shortening both time to market and time to yield. For more information on the company and its products, please visit the LogicVision website at http://www.logicvision.com.

SOURCE LogicVision, Inc.

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