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SiC Systems, Inc. News
SiC Systems Series A Round Will Fund 6" SiC Wafer Development
SiC Systems, Inc. News
SiC Systems Series A Round Will Fund 6" SiC Wafer Development
GOLDEN, Colo.,
SiC Systems' patent-pending manufacturing process, in development for almost two years, overcomes the fundamental design challenges present in current manufacturers' methods. The proprietary system will permit SiC Systems to produce even larger diameter wafers in the future with the process which features none of the scaling or quality problems which plague the nascent industry currently.
Said
Developers interested in obtaining research and development quantity samples of the wafers should direct inquiries to Sales@SiCSystems.com.
SiC Systems is a privately held early-stage development company headquartered in Golden, Colorado. Questions regarding this release can be directed to Info@SiCSystems.com or to
This press release contains statements, which may constitute "forward- looking statements" within the meaning of the Securities Act of 1933 and the Securities Exchange Act of 1934, as amended by the Private Securities Litigation Reform Act of 1995. The company undertakes no obligation to update or revise forward-looking statements to reflect changed assumptions, the occurrence of unanticipated events or changes to future operating results.
Website: http://www.sicsystems.com
This release was issued through eReleases(TM). For more information, visit http://www.ereleases.com.
SOURCE SiC Systems, Inc.



