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2008 International Reliability Physics Symposium Continues Growth in Phoenix
PHOENIX-(Business Wire)-May 1, 2008 - The IEEE International Reliability Physics Symposium (IRPS) 46th annual conference began Sunday, April 27 and runs through Thursday, May 1 at the Hyatt Regency Phoenix at Civic Plaza in Phoenix, Ariz. This is the third visit to Phoenix since 2004 for the IRPS.
"We've grown every year we've been in Phoenix," said Dr. John Suehle, general chair of the 2008 IRPS. "This year, more than 160 technical papers were presented with nearly 500 engineers and scientists in attendance."
Technical Paper Awards
The 2007 IRPS best paper awards were announced on the evening of Tuesday, April 29.
The 2007 IRPS Best Paper Award is "Quantum Mechanical Treatment of Si-O Bond Breakage in Silica Under Time Dependent Dielectric Breakdown Testing," by Joseph McPherson of Texas Instruments.
The 2007 Best Student Paper Award, "Density of States and Structure of NBTI-Induced Defects in Plasma-Nitrided PMOSFETS," was presented to Jason Campbell of Penn State University. Co-authors include Prof. P.M. Lenahan of Penn State University, and A. Krishnan and S. Krishnan of Texas Instruments.
The 2007 Best Poster Award was given to A. Ditali, H. Le, D. Butler, M. Ingram and M. Ma of Micron Technology for their paper, "Correlating Wafer-Level TDDB Lifetime Projections to HTOL Gate Oxide Failures."
The IEEE Fellow Award was conferred to Dr. Eishi Ibe of Hitachi Production Engineering Research Lab in Yokohama, Japan. Dr. Ibe is being recognized for contributions to neutron-induced soft error analysis for semiconductor memory devices.
Keynote Address
Dr. Michael Pecht, chair professor and the director of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, gave this year's keynote address, "A New Approach to Qualification Testing," on Tuesday, April 29.
"Dr. Pecht discussed the problem where a large number of products that pass qualification tests may fail upon use," reported Dr. Suehle. "Although the costs of these failures are in the billions of dollars, Dr. Pecht discussed prognostics as a process to assess degradation and provide a more accurate prediction of the product's reliability."
About IRPS
For more than four decades, IRPS has been one of the leading meetings for engineers in the area of electronic component reliability. IRPS promotes the comprehension of reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user's environment. Originally started in the early 1960s by the military and aerospace community, IRPS is now sponsored by IEEE Reliability Society and IEEE Electron Devices Society. All accepted IRPS papers will appear in the symposium proceedings publication, as well as on the Virtual IRPS DVD-ROM, which is available now for the previous 2007 IRPS.
For further information, please visit the IRPS web site at www.irps.org.
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