News
MCT Receives Additional Tri Temp Strip Orders
ST. PAUL, Minn.-(Business Wire)-April 30, 2008 - Micro Component Technology, Inc. (OTCBB: MCTI) today announced the receipt of orders for additional Strip Test Handler products in excess of $1.3 million. The delivery of these units is scheduled for second quarter of 2008.
MCT's President, Chairman and Chief Executive Officer, Roger E. Gower, commented, "Previously we indicated the shipping of two new products in 2008. This was already accomplished and initial customer production is in progress on both. Today, we are pleased to announce multiple unit orders for our existing Strip Test handlers from important existing customers. Repeat orders of MCT's strip test handling equipment continues to validate the cost effectiveness of MCT strip test solutions in many of the new packages, such as automotive applications. As existing customers exceed expectations, they continue to both expand products tested in strip format with temperature control and provide strong evidence to other potential new customers who are faced with tremendous cost, quality, and technology based pressures."
MCT is a leading manufacturer of test handling and automation solutions satisfying the complete range of handling requirements of the global semiconductor industry. MCT has recently introduced several key new models under its Tapestry SC line of industry leading Strip Handling and Marking products. This new equipment includes the Tapestry SC Tri-Temp(TM) (Strip Handler), Tapestry SmartMark SC(TM)(Strip Marker), and Tapestry FFC(TM) (Film Frame Handler), which are designed to automate the back-end of the semiconductor manufacturing process. MCT believes it has the largest installed IC test handler base of any manufacturer, with over 11,000 units worldwide. MCT is headquartered in St. Paul, Minnesota, with its core manufacturing operation in Penang, Malaysia. MCT is traded on the OTC Bulletin Board under the symbol MCTI.
For more information on the Company, visit its web site at http://www.mct.com
Except for the historical information contained herein, the matters discussed in this news release are forward looking statements that involve risks and uncertainties, including the timely development and acceptance of new products, the impact of competitive products and pricing, the impact on cash and results of operations from a flattening or renewed downturn in the semiconductor capital equipment market, the need for additional financing, and the other factors detailed from time to time in the Company's SEC reports, including but not limited to the discussion in the Risk Factors and Management's Discussion & Analysis included in Form 10-K for the year ended December 31, 2007.
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