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Apache Design Solutions CEO Andrew Yang to Participate in a Panel Discussion on IC-Package-Board Co-Design
SANTA CLARA, Calif.-(Business Wire)-January 31, 2008 - Apache Design Solutions, the technology leader in power signoff and silicon integrity platform solutions, today announced that Andrew Yang, CEO and Chairman of Apache Design Solutions will be participating in a panel titled "Package Extraction, Modeling, and Simulation in IC-Packaging-Board Design" at the DesignCon Conference held in Santa Clara, California. With rising complexity in system designs, there is a need for an accurate IC-package co-design/co-analysis and incremental design enhancements/optimization to ensure properly functioning and cost efficient systems. This panel brings together experts in design and simulation of ICs and packages to discuss the interactions between the two domains and the needed enhancements in electronic design automation solutions. -0- *T WHAT: Packaging Extraction, Modeling, and Simulation in IC-Packaging-Board Design WHERE: DesignCon 2008, Santa Clara Convention Center Santa Clara, California WHEN: Wednesday, February 6, 2008 3:45 pm -5:00 pm *T
For more information visit: http://www.designcon.com/2008/conference/tec_panel_wednesday_package. html(Due to its length, this URL may need to be copied/pasted into your Internet browser's address field. Remove the extra space if one exists.)
About Apache Design Solutions
Apache delivers the leading power signoff solution adopted by 80% of the top IDM, fabless semiconductor, and foundries and a complete platform for silicon integrity of low-power, high-performance system-on-a-chip (SoC) designs. Apache's innovative platform considers multiple noise sources that impact the design—such as power, signal, package / system IO, substrate, and temperature—and enables designers to detect, fix, and prevent design weaknesses that can result in reduced yield or failed silicon and/or system. Apache's vendor-neutral solution supports any industry-standard physical design flow and is certified by TSMC and Common Platform Reference Flows. Apache is a global company with R&D centers and direct sales / support offices worldwide. For more information, visit www.apache-da.com.
