X-FAB to Present Free ‘Lunch & Learn’ Technical Seminar on High-Voltage & Optical Foundry Technologies: “Innovative Semiconductor Product Design Enabled by X-FAB’s ‘More than Moore’ Foundry Technologies”
ERFURT, Germany-(Business Wire)-September 24, 2009 - X-FAB Silicon Foundries, the leading foundry group for analog/mixed-signal semiconductor applications and expert in “More than Moore” technologies, today announced a free, informative “Lunch & Learn” technical seminar to be held in Santa Clara, Calif. The seminar includes a keynote address and technical presentations, and will explore X-FAB’s broad portfolio of More-than-Moore technologies – from advanced CMOS and BiCMOS processes to specialty processes for high-voltage, optical and high-temperature applications. For more information about the seminar, or to register, please visit: http://www.xfab.com/en/about-x-fab/seminar-usa.html
| WHO: | Anyone wanting to learn about the "More than Moore" high-voltage and optical foundry technologies offered by X-FAB. | ||
| WHAT: | Keynote by Dr. Jens Kosch, CTO, “More than Moore: Trend or Hype?” This presentation explores how the technological advance of “More than Moore” is impacting the semiconductor industry. | ||
| Presentation by Dr. Konrad Bach, X-FAB Fellow responsible for CMOS/BiCMOS process development: “Light Sensing Applications Made Easy with X-FAB’s CMOS Technologies.” | |||
| Presentation by Paul Poenisch, Senior Design Support Engineer: “X-FAB’s High-Voltage Technologies and Their Use in Successful HV Design.” | |||
| WHEN: | Wednesday, Sept. 30, 2009 | ||
| 10 – 2 p.m. | |||
| WHERE: | TechMart, Network Meeting Center | ||
| 5201 Great America Pkwy #122 | |||
| Santa Clara, Calif. 95054 | |||
| WHY: | Don’t miss this opportunity for a technical discussion with X-FAB's experts in analog/mixed-signal process technologies. | ||
About X-FAB
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany), Plymouth (UK), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia), and employs approximately 2,600 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.18 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.
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