Dongbu HiTek to Showcase Specialized Chip Processing and Manufacturing Capabilities at GSA Expo & Conference
SEOUL, South Korea-(Business Wire)-September 14, 2009 - Dongbu HiTek today confirmed that it will exhibit at the Global Semiconductor Alliance (GSA) Expo & Conference on October 1, 2009 at the Santa Clara Convention Center in Silicon Valley (Booth Numbers: 801, 803). The Korean company plans to showcase its specialized chip processing and manufacturing capabilities to fabless, IDM and OEM technologists in attendance. Booth visitors can expect to receive the latest updates on the company’s latest push into the Analog arena as well as its world class IP and design resources for BCDMOS, High Voltage, CMOS Image Sensor (CIS) and Embedded Flash technologies.
The Conference portion of the event — focused on “Emerging Opportunities” — will feature seven keynotes from industry executives with expertise in smart grids, cloud computing, 3G wireless gaming, energy harvesting, medical applications, home networking and the innovation business model. For complete program details and to secure a free registration to the Expo portion of the event (Sept. 26th deadline), visit http://tinyurl.com/GSA-DongbuHiTek.
About Dongbu HiTek
With headquarters in Seoul Korea, Dongbu HiTek Co., Ltd. (KRX: 000990) offers advanced products and services across two major business domains: Agriculture and Semiconductor. The Semiconductor Business provides specialized chip processing services. The company’s two world-class fabs currently process 200mm (8-inch) wafers at nodes ranging from 0.35 microns to 90 nanometers. This wafer processing is supported by comprehensive design support (IP and design libraries), prototype development/verification, and packaging/module development. For more information, visit www.dongbuhitek.com.
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